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Ȩ Ȩ > ¿¬±¸¹®Çå > Çмú´ëȸ ÇÁ·Î½Ãµù > Çѱ¹Á¤º¸Åë½ÅÇÐȸ Çмú´ëȸ > 2010³â Ãß°èÇмú´ëȸ

2010³â Ãß°èÇмú´ëȸ

Current Result Document : 7 / 10 ÀÌÀü°Ç ÀÌÀü°Ç   ´ÙÀ½°Ç ´ÙÀ½°Ç

ÇѱÛÁ¦¸ñ(Korean Title) Power Management IC¿ë One-Time Programmable Memory Cell ¼³°è
¿µ¹®Á¦¸ñ(English Title) Design of a One-Time Programmable Memory Cell for Power Management ICs
ÀúÀÚ(Author) ÀüȲ°ï   ¿©¾ï³ç   ±è·Á¿¬   ±èµÎÈÖ   ÀåÁöÇý   ÀÌÀçÇü   ÇÏÆǺÀ   ±è¿µÈñ   Hwang-Gon Jeon   Yi-Ning Yu   Li-Yan Jin   Du-Hwi Kim   Ji-Hye Jang   Jae-Hyung Lee   Pan-Bong Ha   Young-Hee Kim  
¿ø¹®¼ö·Ïó(Citation) VOL 14 NO. 02 PP. 0084 ~ 0087 (2010. 10)
Çѱ۳»¿ë
(Korean Abstract)
º» ³í¹®¿¡¼­´Â power management IC¿¡ »ç¿ëµÇ´Â ¾Æ³¯·Î±× Æ®¸®¹Ö¿ë antifuse OTP ¼¿À» Á¦ÀÛÇÏ¿´´Ù. VPP (=7V)¿Í VNN (=-5V)ÀÇ Dual program voltage¸¦ ÀÌ¿ëÇÏ´Â antifuse OTP ¼¿Àº antifuse ¾ç´Ü¿¡ hard breakdown ÀÌ»óÀÇ Àü¾ÐÀ» Àΰ¡ÇÏ¿© thin gate oxide¸¦ breakdown½ÃŲ´Ù. 0.18§­ BCD °øÁ¤À» ÀÌ¿ëÇÏ¿© Á¦ÀÛµÈ antifuse OTP ¼¿ÀÇ ¸éÀûÀº 48.01§­2À¸·Î eFuse OTP ¼¿ ¸éÀûÀÇ 44.6% ¼öÁØÀÌ´Ù. 20°³ÀÇ Å×½ºÆ® ÆÐÅÏÀ» ÃøÁ¤ÇÑ °á°ú ÇÁ·Î±×·¥ ÈÄ antifuseÀÇ ÀúÇ×Àº ¼ö k§Ù ÀÌÇÏ·Î ¾çÈ£ÇÏ°Ô ÃøÁ¤µÇ¾ú´Ù.
¿µ¹®³»¿ë
(English Abstract)
We manufacture an antifuse OTP (One-time programmable) cell for analog trimming which will be used in power management ICs. For the antifuse cell using dual program voltage of VPP (=7V) and VNN (=-5V), the thin gate oxide is broken down by applying a voltage higher than the hard break-down voltage to the terminals of the antifuse. The area of the manufactured antifuse OTP cell using 0.18§­ BCD process is 48.01§­2 and is about 44.6 percent of that of an eFuse cell. The post-program resistances of the antifuse are good with the values under several kilo ohms when we measure twenty test patterns.
Å°¿öµå(Keyword) Antifuse OTP cell   post-program resistance   power management IC  
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