JICCE (한국정보통신학회)
Current Result Document : 7 / 7
| 한글제목(Korean Title) |
Bringing 3D ICs to Aerospace : Needs for Design Tools and Methodologies |
| 영문제목(English Title) |
Bringing 3D ICs to Aerospace : Needs for Design Tools and Methodologies |
| 저자(Author) |
Sung Kyu Lim
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| 원문수록처(Citation) |
VOL 15 NO. 02 PP. 0117 ~ 0122 (2017. 06) |
한글내용
(Korean Abstract) |
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영문내용
(English Abstract) |
Three-dimensional integrated circuits (3D ICs), starting with memory cubes, have entered the mainstream recently. The benefits many predicted in the past are indeed delivered, including higher memory bandwidth, smaller from factor, and lower energy. However, 3D ICs have yet to find their development in aerospace applications. Next, we discuss research needs to extend their capabilities to ensure reliable operations under the harsh space environments. We first present a design methodology that performs fine-grained partitioning of functional modules in 3D ICs for power reduction. Next, we discuss our multi-physics reliability analysis tool that identifies thermal and mechanical reliability trouble spots in the given 3D IC layouts. Our tools will help aerospace electronics designers to improve the reliability of these 3D IC components while not degrading their energy benefits.
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| 키워드(Keyword) |
3D ICs
Aerospace applications
Design tools
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| 파일첨부 |
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