Çѱ¹Á¤º¸Åë½ÅÇÐȸ ³í¹®Áö (Journal of the Korea Institute of Information and Communication Engineering)
ÇѱÛÁ¦¸ñ(Korean Title) |
Hemispherical Grain Silicon¿¡ ÀÇÇÑ Á¤Àü¿ë·® È®º¸ ¹× °øÁ¤Á¶°Ç Ư¼º¿¡ °üÇÑ ¿¬±¸ |
¿µ¹®Á¦¸ñ(English Title) |
A Study on Capacitance Enhancement by Hemispherical Grain Silicon and Process Condition Properties |
ÀúÀÚ(Author) |
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Yang-Hee Joung
Jae-Young Choung
Seung-Hee Lee
eong-Jun Kang
Bo-Hee Lee
Il-Hyun You
Nam-Sup Choi
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¿ø¹®¼ö·Ïó(Citation) |
VOL 04 NO. 04 PP. 0809 ~ 0815 (2000. 11) |
Çѱ۳»¿ë (Korean Abstract) |
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¿µ¹®³»¿ë (English Abstract) |
The box capacitor structure with HSG-Si described here reliably achieves a cell capacitance of 28fF with a cell area of a 0.482§©÷ for 128Mbit DRAM. An HSG-Si formation technology with seeding method, which employs Si2H6 molecule irradiation and annealing, was applied for realizing 64Mbit and larger DRAMS. By using this technique, grain size controlled HSG-Si can be fabricated on in-situ phosphorous doped amorphous silicon electrodes. The HSG-Si fabrication technology achieves twice the storage capacitance with high reliability for the stacked capacitors.
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